AIC Partners with AMD to Advance Next-Generation AI Infrastructure, Entering Growth Phase with the “Helios” Rack-Scale Platform

[Taipei, May 21, 2026] As global demand for AI infrastructure continues to surge, AMD announced in today’s press release an investment of more than USD 10 billion in Taiwan, joining forces with key supply chain partners to accelerate the development of next-generation AI infrastructure. Among them, Advanced Industrial Computer, Inc. (AIC), as a core partner in AMD’s rack-scale “Helios” platform initiative, once again received official confirmation of its close collaboration in AMD’s press release today, highlighting a milestone achievement in the deepening partnership between the two companies in AI infrastructure development

In its newly announced investment plan, AMD stated that it will fully advance rack-scale AI architecture, advanced packaging, and high-performance computing platforms to address the explosive growth of large language models (LLMs), generative AI, and enterprise AI applications. The strategic alliance between AIC and AMD on the “Helios” platform has been established for some time. As early as October last year (2025), during its earnings conference, AIC revealed its key role as the first rack-scale platform partner for the AMD Instinct MI450 series GPUs. AMD’s official announcement today further solidifies AIC’s technological leadership and pivotal position within the high-performance AI supply chain.

Michael Liang, President and CEO of AIC, stated, “AIC is honored to work closely with AMD on the ‘Helios’ project, supporting the development of the advanced AI infrastructure platform architecture. Our comprehensive collaboration in rack-scale systems and compute tray design reflects the strong partnership between AIC and AMD, as well as our shared commitment to delivering scalable and high-performance solutions for next-generation AI.”

As AI models continue to scale rapidly, AI data centers are evolving from standalone server architectures toward integrated rack-level designs. To meet the enormous demand from hyperscalers for next-generation AI servers, future AI infrastructure will require not only ultra-high-density GPU computing capabilities, but also solutions to challenges in high-speed interconnects, thermal efficiency, and power management. The AMD “Helios” vertically optimized rack platform, developed with AIC’s participation, represents a key direction for balancing high performance and energy efficiency in next-generation AI data centers. Having successfully transformed into a leading provider of enterprise storage and AI server barebone systems, AIC leverages over 30 years of R&D and manufacturing expertise to deliver solutions spanning AI GPU servers, high-density NVMe storage systems, JBOD, and integrated rack-scale platform solutions. As AMD “Helios” rack-scale products are expected to be gradually deployed to major global customers starting in mid-2026, AIC is poised to enter a new phase of stable growth momentum.

During the upcoming COMPUTEX 2026, AIC will also showcase its latest AI storage, rack-scale AI computing, and intelligent edge platform solutions under the theme “Leading AI Storage Next.” Focusing on high-density AI infrastructure, AIC aims to fully address the market’s strong demand driven by the next AI supercycle.