KEY FEATURE
1U all-flash server solution
FEATURE12 x 2.5” front hot-swappable NVMe bays
FEATURESupports dual 5th Gen Intel® Xeon® Scalable Processors (codename: Emerald Rapids)
FEATURESupports dual 4th Gen Intel® Xeon® Scalable Processors (codename: Sapphire Rapids)
FEATURE32x DDR5 RDIMM and 4x PCIe Gen5 extensions
FEATURESPECIFICATION
Dimensions
Motherboard
Processor
• 4th Gen Intel® Xeon® Scalable Processors (Sapphire Rapids)
(Please contact AIC Technical Support for more info/details about optimized CPUs and specialized system.)
Chipset Support
System Memory
• DDR5 5600MHz (1DPC) 4400MTS (2DPC) by Emerald Rapids CPU
• Total 32 memory slots; 16 slots per CPU (2DPC)
Front Panel
• 1 x System reset button
• 1 x System ID button/LED
• 1 x System alert (BMC)
• 1 x USB 3.0
LEDs
Drive Bays
Backplane
Expansion Slots
• 2 x OCP 3.0 bays (PCIe X16 width)
System Bios
• PXE
• WOL
• AC loss recovery
• BIOS recovery
• IPMI 2.0 KCS mode interface
• SRIOV
• SMBIOS
• TPM
• Serial console redirection
• PCIe hotplug
On Board
Intel® Emmitsburg PCH on-chip solution
• M.2: 2 x M.2/M-Key/22110/2280 (PCIe Gen4)
• Baseboard Management Controller
• Intelligent Platform Interface 2.0 (IPMI 2.0)
• iKVM, Media Redirection, IPMI over LAN, Serial over LAN
• HTML5
• Redfish
• SMASH Support
• PCIe Graphic/2D Controller
• 1920x1200@60Hz 32bpp
Rear I/O
TPM Support
Power Supply
• 2000W redundant power supply 80+ Platinum/Titanium
System Cooling
System Management
• Baseboard Management Controller
• Intelligent Platform Interface 2.0 (IPMI 2.0)
• iKVM, Media Redirection, IPMI over LAN, Serial over LAN
• HTML5, Redfish, SMASH Support
Environmental Specifications
• Operating temperature : 0ºC(32ºF) ~ 35ºC(95ºF)
• Storage operating humidity : 5%~95% non-condensing
Gross Weight (W/PSU& Rail)
Packaging Dimensions (W x D x H)
Mounting (Standard)
* All specifications are subject to change without notice.
| SKU Information | Description |
|---|---|
|
XP1-S102HK01 |
1U 12-bay 2.5” hot swap by 3 x PCIe Gen.5 NVMe 4-port backplane, 8x 4056 FAN, 1600W redundant power supply Platinum, Horkos motherboard, Intel Emmitsburg, DDR5 RDIMM x32, Intel PCH C741, 1 x GbE dedicate IPMI, 2x PCIe x16 Gen.5 (FHHL), 2x OCP 3.0 x16 Gen.5, 2x CPU heatsink TDP 250W, 33" slide rail, Gen-Z to PCIe cable cem (for add-on card support) x2, w/o bezel |
|
XP1-S102HK02 |
1U 12-bay 2.5" hot-swap, 3x PCIe Gen.5 NVMe 4-port backplane, 8x 4056 FAN, 1600W redundant power supply Titanium, Horkos motherboard, Intel Emmitsburg, DDR5 RDIMM x32, Intel PCH C741, 1 x GbE dedicate IPMI, 2x PCIe x16 Gen.5 (FHHL), 2x OCP 3.0 x16 Gen.5, 2x CPU heatsink TDP 250W, 33" slide rail, Gen-Z to PCIe cable cem (for add-on card support) x2, w/o bezel |
|
XP1-S102HK03 |
1U 12-bay 2.5" hot-swap, 3x PCIe Gen.5 NVMe 4-port backplane, 8x 4056 FAN, 1600W redundant power supply Platinum, Horkos motherboard, Intel Emmitsburg, DDR5 RDIMM x32, Intel PCH C741, 1 x GbE dedicate IPMI, 2x PCIe x16 Gen.5 (FHHL), 2x OCP 3.0 x16 Gen.5, 2x CPU heatsink TDP 300W, 33" slide rail, Gen-Z to PCIe cable cem (for add-on card support) x2, w/o bezel |
|
XP1-S102HK04 |
1U 12-bay 2.5" hot-swap, 3x PCIe Gen.5 NVMe 4-port backplane, 8x 4056 FAN, 1600W redundant power supply Titanium, Horkos motherboard, Intel Emmitsburg, DDR5 RDIMM x32, Intel PCH C741, 1 x GbE dedicate IPMI, 2x PCIe x16 Gen.5 (FHHL), 2x OCP 3.0 x16 Gen.5, 2x CPU heatsink TDP 300W, 33" slide rail, Gen-Z to PCIe cable cem (for add-on card support) x2, w/o bezel |
| FRU Information | ||
|---|---|---|
| Standard Parts List | Part Number | Description |
| Backplane | BBP-FB10010AB01 | 4 port PCIe Gen 5 NVMe backplane with MCIO 8i*2 (BP-FB1U05-TY) |
| Power supply | PM-C00000099 | 1600W redundant power supply module Platinum (with C14 plug) |
| Power supply | PM-A00000136 | CRPS-185/1600W/TITANIUM/AC-DC/PMBus1.2/100-240Input |
| Fan | FC-C00001014 | 4056 fan L200MM |
| Riser card | G3-A00001149 | PCIe Gen 5 Gen-Z to x16 cable cem for add-on card support |
| Slide rail | H5541T100005 | 33" tool-less slide rail |
