AIC

Product
  • PSG-GB-1URAQDP03

    Features & Benefits
    (BTO)
    1U 2-bay DP General Purpose Server Bare-bone supports Dual/Quad Core processors. PSG-GB-1URAQDP03 harnesses MAX I/O™ technology, maximizing the usage of off-the-shelf expansion cards in the bare-bone.
    Product Image

    Features & Benefits
    • Intel® 5100 + Intel® ICH9R with 5+ year life cycle
    • Flexible I/O usage with Max I/O - up to 3 OTS (off-the-shelf) cards in 1U
      (2 x full height, full length + 1 x low profile)
    • Short 20" depth with standard power + 2 x removable 3.5" HDD
    • Front-to-back airflow provides optimal thermal conditions
    • Customizable to meet your requirements

    Specifications

    Motherboard
    Motherboard PSG-M-AQDP5100-110
    Dimensions
    W x D x H 17" x 20" x 1.75"
    Processor
    Processor • Dual 771-pin LGA sockets
    • Supports single or dual Intel® 64-bit Xeon® processors
    CPU Type • Quad-Core Intel® Xeon® processor 5400/5300 series (Harpertown/Clovertown)
    • Dual-Core Intel® Xeon® processor 5200/5100 series (Wolfdale/Woodcrest)
    System Bus 1066/1333 MHz
    Front Panel

    Buttons

    • Power ON/OFF
    • System reset
    • System ID

    LEDs

    • Power
    • Hard drive activity
    • Network activity

    Drive Bays
    Drive Bays Two(2) x 3.5" hot-swap SATA hard drive trays
    Expansion Slots
    Expansion Slots • 1 x PCIe X8 (w/ X4 link, low-profile)
    Plus option of one of the following riser card configurations to support full-height, full-length cards:
    • 2 x PCIe X8
    • 1 x PCIe X8 + 1 x PCI-X
    • 2 x PCI-X
    • 1 x PCIe X16
    System Memory
    System Memory • Six (6) 240-pin DIMM sockets
    • Support up to 48 GB 667/533 DDR2
      Registered ECC SDRAM
    System BIOS
    BIOS Type AMI BIOS
    SPI (Serial Peripheral Interface) FLASH Interface

    BIOS Features

    • ACPI 1.0/2.0/3.0
    • PXE 2.0
    • AC loss recovery
    • IPMI KCS interface
    • SMBIOS 2.0
    • Serial console re-direction
    On-Board Devices
    Chipset • Intel® 5100 (San Clemente) chipset
    • Intel® ICH9R
    SATA • Built-in Intel® ICH9R SATA2 controller
    • RAID 0, 1, 5, 10 (Windows)
    • RAID 0, 1, 10 (Linux)

    IPMI

    Aspeed AST2050 BMC
    • Intelligent Platform Management Interface 2.0 (IPMI 2.0)
    • iKVM, Media Re-direction, IPMI over LAN, Serial over LAN
    • SMASH support

    Network Controllers

    • Intel® 82571EB (Ophir) PCI Express dual-port GbE controller; MAC/PHY/SerDes
    • Intel® 82575EB (Zoar) PCI Express dual-port GbE controller; MAC/PHY/SerDes/SGMII
    • Intel® 82566DM (Nineveh) GLCI single-port GbE controller; PHY
      (for heartbeat in dual-node system or management)

    Graphics

    Aspeed AST2050 graphics controller
    • Up to 128 MB of memory
    • 1600 x 1200 @ 60 Hz, 16bpp
    Super I/O Winbond W83627DHG
    SATA/SAS Backplane
    SATA/SAS BP 2 x single bay
    Input/Output
    Serial ATA 4 x SATA connectors
    LAN 4 x RJ-45 external ports
    1 x RJ-45 internal port
    USB 3 x USB external ports (2 x rear + 1 front)
    VGA 1 x VGA port
    1 x VGA internal header

    Serial Port

    1 x Serial external port
    1 x Serial internal header
    Power Supply

    Power Supply

    5000W power supply
    • 1U single
    • 90-264VAC, 47-63 Hz
    System Cooling

    System Cooling

    • 4 x 40mm x 56mm, 15.8K rpm
    • 2 x 40mm x 28mm, 16.5K rpm
    System Management
    System Management • IPMI 2.0 compliance
    • KVM over IP
    • Media redirection
    • CPU temperature(PCEI)
    • System temperature
    • FAN speed detection
    • Smart FAN speed control
    • System ID/System Fail indicator
    • SMASH Support
    • Remote Power ON/OFF/RESET
    Operating Environment
    Environmental Specifications • Operating Temperature: 0 ~ 40°C
    • Operating Altitude Condition: 0 ~ 10K feet
    • Storage Temperature: -20 ~ 60 °C
    • System Relative Humidity: 5% to 95% (38°C) non-condensing

    * All specifications are subject to change without notice.

    Built-to-order(BTO):
    Order Information:
    Industry Standard:
    Materials:
    Finish:
    Inside / Body:
    Outsize / Front:
    Dimensions:
    (W x D x H)
    mm: 0 x 0 x 0
    inches: " x " x "
    Cooling:
    Front:
    Middle:
    Rear:
    Expansion:
    Controls:
    Indicators:
    Speakers:
    System Board:
    Drive Bay:
    External
    5.25"
    3.5"
    3.5" hot-swap
    2.5" hot-swap
    Internal
    3.5"
    2.5"
    Slim CD-Rom/DVD-Rom
    Slim FDD
    Temperature:
    Humidity:
    Gross Weight:
    Package Dimension(W x D x H):   mm: x x
    Cubic Feet:
    Expander:
    Reference Container Loading: 20'
    40'
    40' H